Interlayer bonding and Z-strength
Why layer time and deposition-interface temperature affect interlayer bonding, low Z-strength, and delamination risk.
Open layer adhesion pageResources
Evaluate whether localized thermal control fits your large-format extrusion AM process.
Resources
Understand common large-format extrusion AM challenges.
Explore short guides on interlayer bonding, retained heat, thermal process windows, and repeatability, and see where localized thermal control can help.
Slumping, sagging, warping, distortion
How retained heat can create dimensional instability when the broader part gets too hot to hold geometry.
Open heat accumulation pageHot enough to bond, stable enough to hold shape
How interlayer temperature, localized heating, and active cooling define the useful LFAM process window.
Open thermal window pageProcess data and build records
How thermal history and process logs support repeatability, review, and qualification discussions.
Open repeatability pageHow LEAM works
Understand localized interface heating, retained heat management, sensing, and process-window constraints.
Open technology overviewRetrofit hardware layer
Review the cabinet, end effector, machine communication, cooling connections, safety concept, and installation service options.
Open DEMEX systemPDF overview
Share a concise overview of the layer-adhesion problem, LEAM thermal-control principle, DEMEX retrofit scope, applications, and fit review inputs.
Open LEAM overview PDFDEMEX system scope
Review the customer-approved DEMEX scope: cabinet, end effector, machine communication, cooling connections, installation options, and site requirements.
Open DEMEX scope PDFNext step
Let's figure out your application together.
For a useful first review, include your machine or platform, material, target part size, wall or bead dimensions, print speed, throughput, and the thermal limitation you are trying to solve.